{
   "CVE_data_meta": {
      "ASSIGNER": "product-security@qualcomm.com",
      "ID": "CVE-2021-30341",
      "STATE": "PUBLIC"
   },
   "affects": {
      "vendor": {
         "vendor_data": [
            {
               "product": {
                  "product_data": [
                     {
                        "product_name": "Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables",
                        "version": {
                           "version_data": [
                              {
                                 "version_value": "APQ8009W, APQ8096AU, AQT1000, AR8035, CSRB31024, MDM8207, MDM9205, MDM9206, MDM9207, MDM9250, MDM9607, MDM9628, MDM9640, MSM8909W, MSM8996AU, QCA4004, QCA6174A, QCA6390, QCA6391, QCA6420, QCA6426, QCA6430, QCA6436, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA8081, QCA8337, QCA9367, QCA9377, QCA9379, QCM2290, QCM4290, QCM6125, QCM6490, QCS2290, QCS410, QCS4290, QCS610, QCS6125, QCS6490, QCX315, QSW8573, SA415M, SA515M, SD 675, SD 8 Gen1 5G, SD 8cx Gen2, SD205, SD210, SD429, SD460, SD480, SD660, SD662, SD665, SD675, SD678, SD680, SD690 5G, SD720G, SD730, SD750G, SD765, SD765G, SD768G, SD778G, SD780G, SD7c, SD850, SD855, SD865 5G, SD870, SD888, SD888 5G, SDA429W, SDM429W, SDW2500, SDX12, SDX20, SDX24, SDX55, SDX55M, SDX65, SDXR1, SDXR2 5G, SM6250, SM6250P, SM6375, SM7250P, SM7315, SM7325P, SW5100, SW5100P, WCD9306, WCD9330, WCD9360, WCD9370, WCD9375, WCD9380, WCD9385, WCN3610, WCN3620, WCN3910, WCN3950, WCN3988, WCN3991, WCN3998, WCN6740, WCN6750, WCN6850, WCN6851, WCN6855, WCN6856, WSA8830, WSA8835"
                              }
                           ]
                        }
                     }
                  ]
               },
               "vendor_name": "Qualcomm, Inc."
            }
         ]
      }
   },
   "data_format": "MITRE",
   "data_type": "CVE",
   "data_version": "4.0",
   "description": {
      "description_data": [
         {
            "lang": "eng",
            "value": "Improper buffer size validation of DSM packet received can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables"
         }
      ]
   },
   "impact": {
      "cvss": {
         "baseScore": 9.8,
         "vectorString": "CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H",
         "version": "3.1"
      }
   },
   "problemtype": {
      "problemtype_data": [
         {
            "description": [
               {
                  "lang": "eng",
                  "value": "Stack-based Buffer Overflow in Data Modem"
               }
            ]
         }
      ]
   },
   "references": {
      "reference_data": [
         {
            "name": "https://www.qualcomm.com/company/product-security/bulletins/april-2022-bulletin",
            "refsource": "CONFIRM",
            "url": "https://www.qualcomm.com/company/product-security/bulletins/april-2022-bulletin"
         }
      ]
   }
}